MicroCom 2016 accepts papers!

MicroCom 2016 blog

The 1st EAI International Conference on Micro-Electronics and Telecommunication Engineering (MicroCom 2016) will take place in Ghaziabad, India on September 22-23, 2016.

The objective of the Conference is to provide a forum for engineers, academicians, scientists, scholars, experts, researchers to present the result of their research activities and advances in the applications and products in the field of Micro-Electronics and Telecommunication Engineering, as well as share ideas, innovations and problem solving techniques with the industries, but also to discuss for implementation of such innovative techniques which enable better implementation of latest technologies in Micro-Electronics and Telecommunication Engineering sector to produce better yield. Participants will also have the opportunity to understand the present day innovations in Micro-Electronics and Telecommunication Engineering sector which evolved from conventional form and is moving towards future expansions.

Topics of interest to the conference are:

  • Computational Electromagnetic;
  • Signal collection and  Storage/representation;
  • Data communication;
  • Data (signal) processing;
  • Monitoring of Data (signal);
  • Multimedia signal processing and coding;
  • Signal Processing in Network Analysis and VLSI architectures;
  • Speaker identification;
  • MEMS and NEMS;
  • Computer Network Analysis and Design;
  • Application of DSP in Remote Sensors;
  • Image and Multidimensional Signal;
  • 3G,4G Mobile systems;
  • Nano Technology;
  • Embedded Systems.

All accepted papers will be submitted for publication to Springer and made available through SpringerLink Digital Library, one of the world’s largest scientific libraries. Proceedings are submitted for inclusion to the leading indexing services: DBLP, Google Scholar, Thomson Scientific ISI Proceedings, EI Elsevier Engineering Index, CrossRef, Scopus, as well as ICST’s own EU Digital Library (EUDL). Authors of the Best Papers will be invited to submit an extended version of their work through the EAI Endorsed Transactions on Mobile Communications and Applications.

Important dates:

Full Paper Submission Deadline: 30th May, 2016

Notification and Registration Deadline: 17th June, 2016

Camera-ready Deadline: 30th June, 2016

For further information about MicroCom 2016, visit the conference official website.

Editorial Staff

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